13 March, 2025

09:00 - 09:45

Morning coffee and registration

09:45 - 10:00

Opening ceremony and keynote addresses

Dr. Ruben Simonyan, Deputy Minister of High-Tech Industry of the Republic of Armenia
Academician Ashot Saghyan, President of the National Academy of Sciences of the Republic of Armenia

10:00 - 12:30

Keynote session

3D IC and AI Solutions by Siemens EDA by Sedrak Sargsyan (Siemens, USA)
The Power of Generative AI for Chip Design by Tigran Sargsyan (Synopsys, Armenia)
AI4EDA & EDA4AI by Yu Huang (University of Fudan, China)
Computer-based design and development of advanced materials: physics-based and/or artificial intelligence? by Peter Coveney (University College London, UK)
Building resilient ecosystem together by Yunsheng Zheng (EDA², China)

12:30 - 13:30

Lunch

13:30 - 15:30

Industrial session 1

Modeling of Chip-Package Interaction (CPI) induced stresses in 3D ICs with Calibre 3DStress by Armen Kteyan (Siemens Armenia)
Machine Learning and Physics-Based Simulations for Hotspots Detection after Chemical-Mechanical Polishing by Ruben Ghulghazaryan (Siemens Armenia)
Utopia EDA: Open-Source Tool for Logic Synthesis and Verification by Alexander Kamkin (Institute of System Programming of RAS, Russia)
How UVM Factory works: Creating and overriding components by Sergey Chusov (National Research University of Electronic Technology, Russia)

13:30 - 15:30

Education and science session 1

Workforce development for the electronic industry: How the Academia can help the industry by Yuri Panchul (Samsung Advanced Computing Lab, USA)
ESL design: evolution from SOC to ASOC by Armine Shaboyan (ProximusDA GmbH, Armenia)
ASOC advantages for EDGE and AI Inference by Yeranuhi Margaryan (Instigate Design, Armenia)
From ASOC to DSOC: Moving EDA tool logic into OS Kernel by Vahagn Poghosyan (Instigate Scientific Research Center Foundation, Armenia)

15:30 - 16:00

Coffee break

16:00 - 18:00

Industrial session 2

3D IC Thermal Analysis with Calibre 3DThermal by Heghine Melkonyan (Siemens Armenia)
3D IC Assembly Verification with Calibre 3DStack by Arman Davtyan (Siemens Armenia)
SVAN: Static Analysis System for the SystemVerilog Hardware Description Language by Ruben Buchatskiy (Institute of System Programming of RAS, Russia)

16:00 - 20:00

Hackathon Session

Introduction lecture by Yuri Panchul (Samsung Advanced Computing Lab, USA)
Lecture by Lilia Kirakosyan (Russian-Armenian University, Armenia)

Agenda

13 March, 2025

09:00 - 09:45

09:45 - 10:00

Dr. Ruben Simonyan, Deputy Minister of High-Tech Industry of the Republic of Armenia

Academician Ashot Saghyan, President of the National Academy of Sciences of the Republic of Armenia

10:00 - 12:30

3D IC and AI Solutions by Siemens EDA by Sedrak Sargsyan (Siemens, USA)

The Power of Generative AI for Chip Design by Tigran Sargsyan (Synopsys, Armenia)

AI4EDA & EDA4AI by Yu Huang (University of Fudan, China)

Computer-based design and development of advanced materials: physics-based and/or artificial intelligence? by Peter Coveney (University College London, UK)

Building resilient ecosystem together by Yunsheng Zheng (EDA², China)

12:30 - 13:30

13:30 - 15:30

Modeling of Chip-Package Interaction (CPI) induced stresses in 3D ICs with Calibre 3DStress by Armen Kteyan (Siemens Armenia)

Machine Learning and Physics-Based Simulations for Hotspots Detection after Chemical-Mechanical Polishing by Ruben Ghulghazaryan (Siemens Armenia)

Utopia EDA: Open-Source Tool for Logic Synthesis and Verification by Alexander Kamkin (Institute of System Programming of RAS, Russia)

How UVM Factory works: Creating and overriding components by Sergey Chusov (National Research University of Electronic Technology, Russia)

13:30 - 15:30

Workforce development for the electronic industry: How the Academia can help the industry by Yuri Panchul (Samsung Advanced Computing Lab, USA)

ESL design: evolution from SOC to ASOC by Armine Shaboyan (ProximusDA GmbH, Armenia)

ASOC advantages for EDGE and AI Inference by Yeranuhi Margaryan (Instigate Design, Armenia)

From ASOC to DSOC: Moving EDA tool logic into OS Kernel by Vahagn Poghosyan (Instigate Scientific Research Center Foundation, Armenia)

15:30 - 16:00

16:00 - 18:00

3D IC Thermal Analysis with Calibre 3DThermal by Heghine Melkonyan (Siemens Armenia)

3D IC Assembly Verification with Calibre 3DStack by Arman Davtyan (Siemens Armenia)

SVAN: Static Analysis System for the SystemVerilog Hardware Description Language by Ruben Buchatskiy (Institute of System Programming of RAS, Russia)

16:00 - 20:00

Introduction lecture by Yuri Panchul (Samsung Advanced Computing Lab, USA)

Lecture by Lilia Kirakosyan (Russian-Armenian University, Armenia)